The Ingot is cut into individual silicon discs called wafers. The thickness of a wafer is about 1mm.
The wafers are polished until they have flawless, mirror-smooth surfaces. Intel buys those manufacturing ready wafers from third party companies. Intel’s highly advanced 32nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip.